Alter Technology and Luceda Photonics Collaborate to Introduce Assembly Design Kit (ADK) for Precision Assembly Services Dedicated to Photonic Integrated Circuits (PICs)
Alter Technology is excited to announce its collaboration with Luceda Photonics to unveil the Assembly Design Kit (ADK) tailored for Alter’s precision assembly services dedicated to Photonic Integrated Circuits (PICs). This collaboration marks a significant stride towards facilitating efficient packaging and bringing manufacturable PIC designs to the market.
The Alter ADK seamlessly integrates with the Luceda Photonics Design Platform, enabling designers to leverage Luceda’s IPKISS software to craft PICs while adhering to packaging rules and constraints. This holistic approach streamlines development processes, reduces manufacturing costs, accelerates time to market, and mitigates risks associated with new product development.
Chiara Alessandri, Product Marketing Manager at Luceda Photonics, commented, “At Luceda Photonics, we recognize the pivotal role of integrating assembly rules into the early stages of the design cycle for photonic integrated circuits. By incorporating packaging rules from inception, we empower our customers to expedite the market introduction of efficient and manufacturable designs. The integration of Alter Technology’s packaging rules into the Luceda Photonics Design Platform signifies a significant advancement in this direction.”
Matt Booker, Commercial Director at Alter UK, emphasized, “Embarking on co-design initiatives from the outset equips our customers with the capability to target robust and deployable packaging platforms, facilitating a swift route to market. Furthermore, this approach enables them to circumvent the substantial Non-Recurring Engineering (NRE) costs and prolonged development cycles typically associated with customized photonics packaging solutions.”
The Luceda ADK for Alter Technology encompasses a packaging template, catering to Si and InP PICs, to accurately position electrical and optical inputs and outputs on the photonic chip. This encompasses placement rules and specifications for DC and RF bondpads, along with automatic placement of fiber loops for optical packaging. Alter’s optical packaging technology comprises:
· Multi-channel optical fiber array alignment.
· Free-space micro-optic alignment.
· Edge-coupled and grating-coupled fiber alignment techniques.
· Laser weld or epoxy attachment of fibers.
· Precision alignment and attachment of laser or photodiode chips to PIC devices.
For electrical interconnection of PIC devices, Alter Technology boasts expertise in Au ball wire bonding, Al and Au Wedge, and Ribbon bonding for RF devices.
The collaboration between Alter Technology and Luceda Photonics is a game-changer in the field of photonic integrated circuit design and manufacturing. Together, they are committed to driving industry growth and inspiring new possibilities with their cutting-edge solutions that expedite time to market and enhance manufacturability.