EMPS, 21-23 November
ALTER participated in the Electronic Materials and Packaging in Space Symposium (EMPS) last 21 to 23 November.
The EMPS Symposium combines the three topics of PCB, electronic assembly and packaging for a review of the state-of-the-art developments in space and high-rel applications. The symposium is organised by ESA’s Materials and Processes section in collaboration with the Components Technologies section.
ALTER presented the following topics:
- Assessing Pseudo-hermeticity on COTS with Plastic Encapsulated Materials by Luis Alejandro Arriaga Arellano
- SiC Plastic High-Temperature Diodes by Juan Moreno
- Capabilities and Significance of Thermomechanical Analysis in Space Applications by Beatriz Sarrión Aceytuno & Luis Arriaga