ALTER add 12” wafer dicing capability to their UK packaging facility.
ALTER TECHNOLOGY UK, part of TUV NORD group, are pleased to announce the production release of 12” / 300mm wafer dicing within our European OSAT capability. This additional capability in the Scottish packaging facility is crucial to supporting the UK and European semiconductor industry.
300mm diameter wafers are set to be the workhorse of the semiconductor industry for the foreseeable future and is now the primary diameter used in new wafer fab installations worldwide. Around 160 wafer fabrication plants are now producing 300mm wafers, and with an average of 10 new installations per year, this number is set to reach 200 by 2026. 300mm installations now surpass the previous standard 200mm (8” wafers).
300mm wafers are ideal for large area die, such as processors and CMOS image sensors, but are now also being used to drive efficiency and lower cost for ASICs and power electronics devices such as transistors.
12” wafer dicing can be combined with ALTER’s automated assembly lines, including overmoulded plastic QFN production, hermetic packaging, or chip-on-board assembly, with customer chips being directly picked from diced wafers and bonded onto package leadframes or substrates.
ALTER can also offer thinning of wafers by using a backgrind process. Our team have experience of mounting and dicing thin wafers down to 100um in thickness. In addition to handling very thin die our company can also dice substrates up to 1mm thick.
A wide variety of wafer and substrate materials can be processed, including Silicon, Multi-Project Wafers (MPW), GaAs, GaN, FR4, Glass, Ceramics and Laminates. Dicing blades of different sizes and materials are stocked and selected depending on the substrate material and thickness.
ALTER can accept customer’s wafers directly from the wafer foundry and provide a complete European OSAT (Outsourced Semiconductor Assembly & Test) service including electronic wafer sort/probing, wafer dicing, packaging, final test and qualification.
A full overview our ALTER’s packaging capability can be found at packaging.altertechnology.com.
For enquires or more information contact: Matt Booker, Commercial & Innovation Director, Matt.Booker@uk.altertechnology.com