ALTER UK

We provide Microelectronics and Optoelectronics package design and assembly services from fast prototyping to production. Typical devices assembled include ASICs, MEMS, Sensors, Image Sensors, LED Chip-on-Board, High-Power Laser diodes, VCSELs and Optical transceivers. Our ISO7 clean room is equipped with a wide range of processes for high-reliability applications including wafer dicing, die-attach, wire and ribbon bonding, hermetic sealing and encapsulation.

ALTER UK have introduced a plastic packaging line in the UK facility to make QFN packaging available to low and medium volume users.

Our Photonics product roadmap includes FLAME and REMOTE, specialist narrow-linewidth laser modules for Quantum technology applications.